• Flip-chip COB is indeed the next generation of COB (Chips on Board) technology, offering significant advancements for the displays you mentioned. Here's a breakdown of how flip-chip COB elevates COB technology:

Traditional COB vs. Flip-chip COB:

• Traditional COB: LED chips are mounted directly onto a substrate with bonding wires for electrical connection. These wires can block light and limit how close the chips can be placed, affecting pixel density and brightness.

• Flip-chip COB: The LED chips are flipped upside down before mounting. This allows for a direct connection to the substrate without bonding wires, enabling:

  • Higher Pixel Density: Closer spacing between chips for sharper images, especially crucial for high-resolution displays like 4K and 8K.

  • Improved Brightness: Unobstructed light path from the LED chips for a brighter display.

  • Thinner Displays: Eliminating bonding wires allows for slimmer designs.